Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

• Niina Halonen,
• Joni Kilpijärvi,
• Maciej Sobocinski,
• Timir Datta-Chaudhuri,
• Antti Hassinen,
• Someshekar B. Prakash,
• Peter Möller,
• Pamela Abshire,
• Sakari Kellokumpu and
• Anita Lloyd Spetz

Beilstein J. Nanotechnol. 2016, 7, 1871–1877, doi:10.3762/bjnano.7.179

• adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a

• medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated. Keywords: capacitance sensing; cell viability; lab-on-a-chip; low temperature co-fired ceramic (LTCC); Introduction Biosafety regulations require ethical, simple, rapid, and cost

• % humidity, and a salt-containing medium for growth). Low temperature co-fired ceramic (LTCC) technology in combination with flip-chip bonding is one method of producing durable, biocompatible packaging for LoCMOS devices. The advantage of the LTCC technology is the possibility of fast and simple 3D